Electronics Forum | Tue Jan 30 14:24:55 EST 2018 | emeto
I used to bake parts before. After I discovered the drying cabinets, that is not a concern anymore. I strongly recommend you to get one of these and try it. It dries them out pretty quick and keeps very low humidity all the time. No heat applied.
Electronics Forum | Wed Dec 17 10:25:47 EST 2003 | blnorman
I may have asked this question before but couldn't find anything when I ran a search. Question, after ultrasonically cleaning our boards we bake them out to drive off residual moisture. Current requirement is 24 hours @ 105�C. I seem to remember a
Electronics Forum | Tue Aug 06 08:54:21 EDT 2002 | mike
I have two basic questions: 1. We have a number of small convection ovens and want to modify some of these for baking out parts when needed. We have tried pumping nitrogen into these but I still run between 35 and 50 RH. Has anyone tried converting a
Electronics Forum | Tue Oct 19 23:17:48 EDT 1999 | Stu Leech
I answered another post regarding the subject of demoisturizing bake-out. Our new process works for taped and reeled devices as well as those in trays. Stu Leech
Electronics Forum | Mon May 24 19:24:35 EDT 2010 | jry74
We bake all of our boards at 220 degrees F for two hours. This bakes out all the moisture. Blow off the parts prior to placing in the oven.
Electronics Forum | Thu Jul 01 11:48:10 EDT 2010 | mb_mfg
Sid, Try baking the boards before running, to insure no moisture. Baking out the moisture will help prevent warping. Should you need further assistance, we supply fixtures to force the board to stay flat to reduce to thermo shock during wave solde
Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal
We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.
Electronics Forum | Fri Feb 02 05:11:29 EST 2018 | deanm
I developed our company's procedure for moisture sensitive devices based on J-STD-033 and I don't recall anything requiring a certain ramp rate. Furthermore baking at 85C will greatly extend the time to reset the clock and it is harder to maintain
Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef
Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
